As applications like AI and machine learning become more common, the demand for higher bandwidth and data processing capabilities is also on the rise. Co-Packaged Optics (CPO) technology, which integrates optics and electronics, is changing data center design by improving power efficiency and bandwidth density.

While CPO is becoming a reality, it also introduces new manufacturing and inspection challenges. Our Co-Packaged Optics Inspection Metrology System is designed to provide packaging engineers with unmatched precision and reliability. By integrating optical line sensors and high-magnification video microscopes with nano-precision air-bearing stages, this system enables the non-destructive inspection of Silicon Photonic Integrated Circuit (PIC) V-groove arrays. This can be done at both the wafer and singulated die levels, which ensures that waveguide fiber connections are optimized.

• Non-Destructive Inspection: Optically inspect PIC integrity before waveguide fiber connections, which preserves component quality.
• 3D Array Reconstruction: Achieve sub-micron axial resolution to measure groove depth, sidewall pitch, sidewall angle, and sidewall flatness.
• Proprietary Algorithms: Deliver precise contact plane information for virtual fiber diameters in each trench.
• High-Magnification Imaging: Three strategically positioned video microscopes provide sub-micron pixel resolution for verifying V-groove top/bottom widths, 2D pitch, and detecting foreign materials on sidewalls and groove surfaces.
• Flexible Configurations: Available as a standalone system with manual wafer loading or with factory automation-enabled EFEM load ports for seamless wafer disposition.

Our metrology system sets a new standard for precision and efficiency in silicon photonics inspection. With advanced imaging, nano-precision stages, and proprietary analytics, it provides packaging engineers with the tools needed to ensure PIC reliability and performance. Whether you're working at the wafer level or with singulated die, our system provides actionable insights without compromising component integrity.