The Solarius AOP-µLED platform for µLED bump inspection application leverages state-of-the-art confocal line sensor technology and high-precision camera-based fiducial alignment to deliver unparalleled accuracy and efficiency in µLED manufacturing.
Why Choose Our Inspection System?
- High-Precision Detection: The confocal line sensor ensures accurate 3D measurement of µLED bumps, detecting even the smallest defects with sub-micron precision.
- Reliable Fiducial Alignment: Our advanced camera system guarantees precise alignment, minimizing errors and enhancing throughput.
- User-Friendly Interface: Intuitive software streamlines operation, reducing training time and improving productivity.
Our system integrates optical line sensor for detailed bump inspection with a high-resolution camera for fiducial mark detection. The sensor scans the µLED surface to measure bump height, width, true position and uniformity, while the camera ensures precise positioning by aligning fiducial marks. This dual approach delivers fast, accurate, and repeatable results, critical for next generation display manufacturing.
Applications
Ideal for µLED production in industries such as consumer electronics, automotive displays, and AR/VR devices. Our solution ensures defect-free bumps, enhancing display quality and reliability.
