Nowadays, wafer measurement is more critical than ever due to the increasing complexity and miniaturization in semiconductor manufacturing. By precisely measuring and controlling wafer geometry, manufacturers can ensure wafer quality, increase yield, and meet the tight specifications required for advanced chips.

Our cutting-edge wafer inspection solution integrates a high-speed area scan sensor to deliver precise measurements of distance, thickness, and surface topography. Designed for high accuracy and efficiency, this system is ideal for semiconductor manufacturing, ensuring critical features like flatness, bow, warp, and thickness are measured with unparalleled precision.

• Seamlessly switch between distance and thickness measuring modes to capture critical wafer and Die characteristics such as flatness, bow, warp, and more.
• Significantly reducing cycle time while maintaining measurement accuracy.
• Utilize Solarius’s intuitive software to create recipes and analysis templates for fully automated measurements and data analysis.
• Operate as a standalone system or integrate with factory automation via EFEM load ports for enhanced wafer disposition functionality.

• Ensure precise, damage-free measurements with advanced non-contact technology.
• Short cycle times optimize production workflows, saving valuable time without compromising accuracy.
• Deliver detailed, reliable results with high-resolution scans and exceptional measurement precision.
• Meet industry standards with results that adhere to ISO and ASME guidelines.
• Streamline operations with automated scanning and analysis for consistent, repeatable results.

Our proprietary software simplifies the measurement process. Define areas of interest, set up recipes, and analyze results with ease. Once configured, recipes and analysis templates enable fully automated inspections, boosting productivity and ensuring consistent outcomes.