Wafer Probing is the last QC operation at the front end of line (FEoL) and the probe card quality and state has a big impact on the wafer test results. Faulty pins (beams), bent probe heads and objects within the probe card clearance can negatively affect the wafer test or even bring damage to an already tested wafer.
In order to easily measure the state of a probe card and to finally mechanically release a probe card for wafer test, SOLARIUS has developed a probe card inspection tool. The AOP-PCI (probe card inspection) is a multi-function, non-contact, non-destructive inspection tool for a holistic probe card checkup. Combining high-precision stages with state of the art sensor and vision systems, Solarius can acquire accurate and reliable data of the probe card tips, head geometry and PCB surfaces even for full sized square direct dock probe cards. In addition, a dedicated measurement algorithm can seamlessly run routine for both data acquisition and analysis.
| Probe Tip / Pin Inspection | Vertical / MEMS / Pogo / Cantilever Height Diameter Misalignment Presence Debris / Particle Coplanarity / Tilt Damage |
| PCB Inspection | Geometry Missing Components Debris / Particle Defects |
| Resolution | Lateral: 50 nm up Vertical: 1 nm up |
| Change over | < 2 mins between Probe Card Interfaces |
| Standards applicable | SEMI, GAMP, FDA (optional) |
| SECS/GEM features | E4, E5, E30, E37, E39, E40, E87, E90, E94, E116, E84 AMHS |
The modular AOP PCI platform can be equipped with lab capabilities for easy probe card rework or can be designed for OHT and/or AGV probe card handling to achieve fully automated production control inside wafer test fabs.
